3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping
نویسندگان
چکیده
A rapid advanced packaging concept, consisting of inkjet photopolymer printing and Ag nanoparticles printing, was investigated for the construction of a pressure sensor package. Acrylatetype 3D package housing with 7 through-holes was printed with a polyjet printer and the throughvias and connection pads were manufactured via Ag glue dispensing and inkjet printing of Ag nanoparticle ink. The flip-chip packaging concept was pursued for the electrical connection between the package and the pressure sensor dye.
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